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| TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com Approval Sheet For Product Specification Issued Date: June, 8, 2004 Product Name: SAW Filter 1880 MHz SMD 3X3 mm TST Parts No.:TA0294A Customer Parts No.: Company: Division: Approved by : Date: Checked by: Approval by: Date: Bob Chau Francis Chen 6, 8, 2004 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document FR-71S03-01 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com SAW Filter 1880 MHz for PCS MODEL NO.: TA0294A A. MAXIMUM RATING: 1.Input Power Level: 10 dBm 2.DC voltage: 5 V 3.Operating Temperature: -30C to +85C 4.Storage Temperature: -40C to +85C B. ELECTRICAL CHARACTERISTICS: Item Center frequency Insertion loss (1850~1910 MHz) Amplitude ripple (1850~1910 MHz) Attenuation (Reference level from 0 dB) D.C. ~ 1660 MHz 1660 ~ 1721 MHz 1721 ~ 1800 MHz 1930 ~ 1990 MHz 2000 ~ 2040 MHz 2040 ~ 2480 MHz 3700 ~ 3820 MHz Input/Output Return Loss (1850~1910 MHz) Source impedance Zs Load impedance ZL Note1. The standard definitions is in JIS C 6703 Fc IL (dB) (dB) (dB) (dB) (dB) (dB) (dB) (dB) (dB) (dB) () () REV. NO.:2 RoHS Compliant Lead free Lead-free soldering Min. 20 30 20 7 25 31 25 7.4 - Typ. 1880 2.45 1.2 32 35 37 19 37 38 35 13 50 50 Max. 4.0 2.5 - TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 C. MEASUREMENT CIRCUIT: HP Network analyzer 50 B SAW Filter E 50 A,C,D,F D. OUTLINE DRAWING: LV : Year Code : Date Code TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 E. Frequency Characteristics : Transfer function TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 Reflections Functions : S11 S22 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 F. PACKING: 1. REEL DIMENSION 2. TAPE DIMENSION LV TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 |
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